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INTEGRATED CIRCUITS
DATA SHEET
TDA8735 PLL frequency synthesizer
Product specification Supersedes data of September 1994 File under Integrated Circuits, IC01 1998 Oct 23
Philips Semiconductors
Product specification
PLL frequency synthesizer
FEATURES * Complete 30 MHz single-chip tuning system * Loop amplifier included * 2-level current amplifier (charge pump) for adjusting the loop gain * A powerful digital memory phase detector * Programmable reference frequencies of 1 kHz, 10 kHz or 25 kHz * I2C-bus interface * Programmable address select input * Software controlled switch output. APPLICATIONS * Satellite sound receiver * Radio receiver: LW, MW and SW. GENERAL DESCRIPTION
TDA8735
The TDA8735 is a single-chip PLL synthesizer designed for satellite receivers. The device can be set to two different addresses which can be used in applications where independently tuned VCOs are required. To adapt to different frequency accuracy, 3 reference frequencies are selectable via the I2C-bus. The charge pump current can be set to 2 values with a ratio of 1 : 100 via the I2C-bus. A programmable switch (open-collector) is integrated to enable mode or normal switching, or other types of application.
QUICK REFERENCE DATA SYMBOL VCC1 VCC2 ICC1 ICC2 fi(max) fi(min) Vi(rms) Ptot Tamb PARAMETER supply voltage (pin 3) supply voltage (pin 16) supply current (pin 3) supply current (pin 16) maximum input frequency minimum input frequency input voltage (RMS value) total power dissipation operating ambient temperature outputs unloaded outputs unloaded CONDITIONS MIN. 4.5 VCC1 12 0.2 30 - 30 - -30 TYP. 5.0 8.5 20 0.5 - - - 0.14 - MAX. 5.5 12 28 1 - 512 500 - +85 UNIT V V mA mA MHz kHz mV W C
ORDERING INFORMATION TYPE NUMBER TDA8735 TDA8735T PACKAGE NAME DIP16 SO16 DESCRIPTION plastic dual in-line package; 16 leads (300 mil); long body plastic small outline package; 16 leads; body width 7.5 mm VERSION SOT38-1 SOT162-1
1998 Oct 23
2
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1998 Oct 23
VCO input prescaler decoupling unit 7 6 PRESCALER 3:4 13-BIT PROGRAMMABLE DIVIDER 4-BIT SWALLOW COUNTER VCC1 3 4 POWER SUPPLY FREQUENCY LATCHES
BLOCK DIAGRAM
Philips Semiconductors
PLL frequency synthesizer
DIGITAL PHASE DETECTOR
2 3-1 MULTIPLEXER REFERENCE COUNTER REFERENCE OSCILLATOR 1
reference oscillator input reference oscillator output
16
VCC2
SWITCH
15
external loop filter output
VEE serial data input (SDA) serial clock input (SCL) address select input
PROGRAMMABLE CURRENT AMPLIFIER
3
14
tuning voltage amplifier input
10 11 I2C-BUS CONTROL
12
TDA8735
SWITCH
8
band switch output
MGH651
Product specification
TDA8735
Fig.1 Block diagram.
Philips Semiconductors
Product specification
PLL frequency synthesizer
PINNING SYMBOL XTAL1 XTAL2 VCC1 VEE n.c. DEC VCOFI BS n.c. SDA SCL AS n.c. LOOPI LOOPO VCC2 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION reference oscillator output reference oscillator input supply voltage 1 ground not connected prescaler decoupling VCO input frequency band switch output not connected serial data input (I2C-bus) serial clock input (I2C-bus) address select input (I2C-bus) not connected tuning voltage amplifier input external loop filter output supply voltage 2 Controls Fig.2 Pin configuration.
handbook, halfpage
TDA8735
XTAL1 XTAL2 VCC1 VEE n.c. DEC VCOFI BS
1 2 3 4
16 VCC2 15 LOOPO 14 LOOPI 13 n.c.
TDA8735
5 6 7 8
MGH650
12 AS 11 SCL 10 SDA 9 n.c.
FUNCTIONAL DESCRIPTION The TDA8735 contains the following parts and facilities: * Input amplifier VCO signal * A prescaler with the divisors 3 : 4 and a 2-bit programmable swallow counter * A 13-bit programmable counter * A digital memory phase detector * A reference frequency channel comprised of a 4 MHz crystal oscillator followed by a reference counter; the reference frequency can be 1, 10 or 25 kHz and is applied to the digital memory phase detector * An I2C-bus interface with data latches and control logic; the I2C-bus is intended for communication between microcontrollers and different ICs or modules. Detailed information on the I2C-bus specification is available on request. * A software-controlled switch output * A programmable current amplifier (charge pump) which consists of a 5 and a 500 A current source, this allows adjustment of loop gain, thus providing high-current high-speed tuning and low current-stable tuning. The output at the loop amplifier can deliver a tuning voltage of up to 10.5 V (VCC2 - 1.5 V).
The TDA8735 is controlled via the 2-wire I2C-bus. As slave receiver for programming there is one module address, a logic 0 (R/W bit), a subaddress byte and four data bytes. The subaddress determines which one of the four data bytes is transmitted first. The module address contains a programmable address bit (D1) which with address select input AS (pin 12) makes it possible to operate two TDA8735 in one system. The auto increment facility of the I2C-bus allows programming of the TDA8735 within one transmission (address + subaddress + 4 data bytes). The TDA8735 can also be partially programmed. Transmission must then be ended by a stop condition. The bit organization of the 4 data bytes is illustrated in Fig.3 and is described below. The divider number is defined by 15-bit words, bits S0 to S14. To calculate the lock frequency, the divider number has to be multiplied by the selected reference frequency.
1998 Oct 23
4
Philips Semiconductors
Product specification
PLL frequency synthesizer
Table 1 Divider number setting; note 1 ON 0 Note 1. Where the minimum divider ratio is: 26 = 64 to 215 - 1 = 32761. Table 2 CP 0 1 Table 3 Bit CP (used to control the charge pump; DB0 : D0) CURRENT LOW HIGH Bits REF1 and REF2 (used to set the reference frequency applied to the phase detector; DB2 : D7 and D6) REF2 0 1 0 1 FREQUENCY (kHz) 1 10 25 0 1 0 Table 5 BS 1 0 Table 4 DIVIDER NUMBER SETTING (S0 + S1) x 21 to + S13 x 213 + S14 x 214
TDA8735
INPUT ON
Bit OPAMP (used to control the switch in the tuning voltage amplifier output circuitry; DB2 : D4) SWITCH on off Bit BS (used to control the open-collector switch output; DB2 : D2) SWITCH OUTPUT sink current floating
OPAMP
REF1 0 0 1 1
The data byte DB3 must be set to 0 to 0. It is also used for test purposes (see Fig.3).
1998 Oct 23
5
Philips Semiconductors
Product specification
PLL frequency synthesizer
TDA8735
handbook, full pagewidth START
condition
programmable address bit (D1) acknowledge R/W MSB
STOP condition LSB MSB LSB MSB LSB MSB LSB
S
MODULE ADDRESS BYTE A7 A0
A
SUBADDRESS A BYTE
DATA BYTE 0
A
DATA BYTE 1
A
DATA BYTE 2
A
DATA BYTE 3
AP
D7 MSB
D0 D7
D0 D7
D0 D7 LSB
D0
MODULE ADDRESS A7
1
1
0
0
0
1
1/0
0 A0
SUBADDRESS
0
0
0
0
0
0
0/1
0/1
MSB DATA BYTE 0 (DB0) S6 D7 MSB DATA BYTE 1 (DB1) S14 D7 MSB DATA BYTE 2 (DB2) REF 1 D7 MSB DATA BYTE 3 (DB3) T1 D7 examples using auto-increment facility S ADDRESS A SUBADDRESS 02 A DB2 A DB3 AP T2 T3 NOT USED NOT USED NOT USED NOT USED REF 2 0 1 NOT USED BS NU S13 S12 S11 S10 S9 S8 S5 S4 S3 S2 S1 S0
LSB CP D0 LSB S7 D0 LSB NU D0 LSB NOT USED D0
S
ADDRESS
A
SUBADDRESS
00 A
DB0
A
DB1
AP
S
ADDRESS
A
SUBADDRESS
03 A
DB3
A
DB0
A
DB1
A
DB2
A
P
MGL509
Fig.3 Bit organization.
1998 Oct 23
6
Philips Semiconductors
Product specification
PLL frequency synthesizer
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC1 VCC2 Ptot Tamb Tstg HANDLING Every pin withstands the ESD test in accordance with "MIL-STD-883C category B" (2000 V). CHARACTERISTICS VCC1 = 5 V; VCC2 = 8.5 V; Tamb = 25 C; unless otherwise specified. SYMBOL Supplies VCC1 VCC2 ICC1 ICC2 supply voltage (pin 3) supply voltage (pin 16) supply current (pin 3) supply current (pin 16) no outputs loaded no outputs loaded TDA8735T only I2C-bus inputs (SDA and SCL) VIH VIL IIH IIL VOL AS input VIH VIL IIH IIL RF input fi(max) fi(min) Vi(rms) Ri Ci 1998 Oct 23 maximum input frequency minimum input frequency input voltage (RMS value) input resistance input capacitance 7 measured in Fig.4 30 - 30 - - - - - 5.9 2 - 512 500 - - HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current AS = C6 AS = C4 3.0 -0.3 - - - - - - 5.0 HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current 3.0 -0.3 - - - - - - - - 5.0 4.5 VCC1 12 0.2 0.7 5.0 8.5 20 0.5 1 5.5 12 28 1 1.5 PARAMETER CONDITIONS MIN. TYP. supply voltage (pin 3) supply voltage (pin 16) total power dissipation operating ambient temperature storage temperature PARAMETER -0.3 VCC1 - -30 -65 MIN. MAX. +5.5 12.5 0.85 +85 +150
TDA8735
UNIT V V W C C
MAX.
UNIT
V V mA mA mA
V V A A
+1.5 10 10
SDA output LOW-level output voltage open-collector; IOL = 3.0 mA 0.4 V
V V A A
+1.0 10 10
MHz kHz mV k pF
Philips Semiconductors
Product specification
PLL frequency synthesizer
TDA8735
SYMBOL
PARAMETER
CONDITIONS -
MIN. -
TYP.
MAX.
UNIT
Oscillator (XTAL1 and XTAL2) Rxtal crystal resonance resistance (4 MHz) see Fig.5 150
Programmable charge pump ICHP output current to loop filter bit CP logic 0 logic 1 logic 0; TDA8735T only Ripple rejection RR V CC1 20 log ----------------V O V CC2 20 log ----------------V O Band switch output (pin 8) VOH VOL ILO Vo(max) Vo(min) Isource Isink Zo(off) Ibias HIGH-level output voltage LOW-level output voltage output leakage current IOL = 3 mA VOH = 12 V Isource = 0.5 mA Isink = 1 mA - - - - - - 12 0.8 10 - 0.8 - - - 5 V V A fripple = 100 Hz 40 50 - - dB 3 400 3 5 500 5 7 600 9 A A A
fripple = 100 Hz
40
50
dB
Tuning voltage amplifier output (pin 15) maximum output voltage minimum output voltage maximum output source current maximum output sink current impedance of switched off output input bias current (absolute value) VCC2 - 1.5 - - 0.5 1.0 5 - - - - - 1 V V mA mA M nA
1998 Oct 23
8
Philips Semiconductors
Product specification
PLL frequency synthesizer
TDA8735
handbook, full pagewidth
VCC1 3 50 coaxial HYBRID JUNCTION -3 dB + - -3 dB 50 4 50 coaxial V R = 50 50 coaxial
AM sine wave generator
TDA8735
10 nF 7 6 50 10 nF
MGL510
Fig.4 Prescaler input sensitivity (set-up measurement).
handbook, halfpage
1 2 4 MHz 27 pF
TDA8735
MGL511
Fig.5 Crystal connection (4 MHz).
1998 Oct 23
9
Philips Semiconductors
Product specification
PLL frequency synthesizer
APPLICATION INFORMATION
TDA8735
handbook, full pagewidth
Ct 27 pF 4 MHz
XTAL1
1
16
C2 VCC2
47 F +12 V
XTAL2
2
15
LOOPO R1
+5 V
VCC1 C1 47 F
3
14
LOOPI C3 220 nF
10 k C5 3.9 nF
tuning voltage output
VEE
4
13
n.c. +5 V AS J1 J2 programmable address J1: A1 = 1; Addr. = C6H J2: A1 = 0; Addr. = C4H
TDA8735
n.c. 5 12
CDEC 10 nF
DEC
6
11
SCL I2C-BUS
VCO CAM VCOFI 7 input 22 nF band switch output 10 k BS Rbs 8
10
SDA
9
MGL512
n.c.
+5 V
Loop filter depends on VCO parameters.
Fig.6 Application example.
1998 Oct 23
10
Philips Semiconductors
Product specification
PLL frequency synthesizer
PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body
TDA8735
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-10-02 95-01-19
1998 Oct 23
11
Philips Semiconductors
Product specification
PLL frequency synthesizer
TDA8735
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp L 1 e bp 8 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1998 Oct 23
12
Philips Semiconductors
Product specification
PLL frequency synthesizer
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
TDA8735
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1998 Oct 23
13
Philips Semiconductors
Product specification
PLL frequency synthesizer
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8735
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1998 Oct 23
14
Philips Semiconductors
Product specification
PLL frequency synthesizer
NOTES
TDA8735
1998 Oct 23
15
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/750/02/pp16
Date of release: 1998 Oct 23
Document order number:
9397 750 04641

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